BONDING MACHINE

AUTO BONDING MACHINE


High capacity with all automatic operation system of SYMKOS Auto Bonding machine

Multiple Types

High Performance

Automate system

Leading Dispenser Technique

SYMKOS

AUTO BONDING MACHINE

Main Feature

√High capacity by

+ All machine operation is automatic

+ Bonding TOP Side together at 2 station or TOP/BOTTOM independently

+ Use 10 Bonding Head together

+ Reduce loss time of glue in put by use Big Tank to keep glue

√Easy JOB change : Change Model by reloading Programming in HMI , Time setting is short

√Designed for Easy control, Easy maintenance and stable running

Machine Structure

Auto Transfer conveyor part

+ Auto Transfer PCBA into each station of Bonding

2) Motion X/Y/Z Part for TOP Side

+ Auto Move Bonding Head base on Position Setting

3) 2 Bonding Station and 2 rotary Part for Bonding Head

+ 1 Station have 5 Head to bonding 1 time for 5 position

And it will be set Enable bonding Position by setting based on each model

+ Bond Header can change degree by rotary part

4) Bonding Tank – 2 Set for separating TOP Side

+ One time can loading Big volume of bonding into Tank

5) Support place: Fixing PCBA when bonding

6) Control Unit

+ Easy Job change and setting machine parameter by HMI touch screen

+ Control panel was designed clearly and run stably

Specs

+ Size(mm): L1200 x W800 x H1650


+ Weight: 200 kg


+ Power: AC220V, 1.5KW


+ PCBA Size(mm): Max L300 x W200 x T50


+ Machine Capacity: 3,5 ~ 4K / Hour  Capacity for 20 hour: 70~80K products


SYMKOS PARTNER - TAEHA - INOVATE DISPENSING TECHNOLOGY

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